X-Ray test is a real-time non-destructive analysis to check the hardware components inside the components. It mainly checks the lead frame of the chip, wafer size, gold wire binding diagram, ESD damage and holes. Customers can provide available samples or

According to the device pins and related instructions specified by the manufacturer in datasheet, use the semiconductor tube characteristic diagram to check whether the chip is damaged by open circuit or short circuit test.

Through professional failure analysis equipment, and analysis methods to help customers analyze the cause of customer product failure and give failure analysis report and analysis conclusions.