External Visual Inspection is a process of checking the quantity of parts, internal package, moisture indicator, desiccation and external package, and then verifying secondary coating, pin condition, sanding marks, foreign materials, manufacturer’s logo p

The standard of solderability test is J-STD-002B, which mainly detects whether the solder capability of the pin is up to standard.

Decapsulation is mainly to use the instrument to corrode the package on the surface of the chip, check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, and the wafer code to determine the authenticity of

We use programming equipment that supports testing 47,000 IC models produced by 208 IC manufacturers. Available include: EPROM, parallel and serial EEPROM, FPGA, configuration of serial PROM, flash memory, BPROM, NOVRAM, SPLD, CPLD, EPLD, microcontroller,